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INTEGRATED CIRCUITS
DATA SHEET
TDA1517; TDA1517P 2 x 6 W stereo power amplifier
Product specification Supersedes data of 1995 Dec 15 File under Integrated Circuits, IC01 1998 Apr 28
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
FEATURES * Requires very few external components * High output power * Fixed gain * Good ripple rejection * Mute/standby switch * AC and DC short-circuit safe to ground and VP * Thermally protected * Reverse polarity safe * Capability to handle high energy on outputs (VP = 0 V) * No switch-on/switch-off plop * Electrostatic discharge protection. QUICK REFERENCE DATA SYMBOL VP IORM Iq(tot) Isb Isw |ZI| Po SVRR cs Gv Vno(rms) Tc PARAMETER supply voltage repetitive peak output current total quiescent current standby current switch-on current input impedance output power supply voltage ripple rejection channel separation closed loop voltage gain noise output voltage (RMS value) crystal temperature RL = 4 ; THD = 0.5% RL = 4 ; THD = 10% fi = 100 Hz to 10 kHz CONDITIONS - - - - 50 - - 48 40 19 - -
TDA1517; TDA1517P
GENERAL DESCRIPTION The TDA1517 is an integrated class-B dual output amplifier in a plastic single in-line medium power package with fin (SIL9MPF) and a plastic heat-dissipating dual in-line package (HDIP18). The device is primarily developed for multi-media applications.
MIN. 6.0 -
TYP. 14.4 40 0.1 - - 5 6 - - 20 50 -
MAX. 18.0 2.5 80 100 40 - - - - - 21 - 150
UNIT V A mA A A k W W dB dB dB V C
ORDERING INFORMATION TYPE NUMBER TDA1517 TDA1517P PACKAGE NAME SIL9MPF HDIP18 DESCRIPTION plastic single in-line medium power package with fin; 9 leads plastic heat-dissipating dual in-line package; 18 leads VERSION SOT110-1 SOT398-1
1998 Apr 28
2
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
BLOCK DIAGRAM
TDA1517; TDA1517P
handbook, full pagewidth
non-inverting input 1
1 60 k
mute switch
Cm
4 VA 2 k 18 k power stage
output 1
VP 8 stand-by switch VA 15 k x1 supply voltage ripple rejection output 3 15 k mute reference voltage 18 k mute switch stand-by reference voltage mute/stand-by switch input
TDA1517
2 k non-inverting input 2 VA 9 60 k input reference voltage mute switch signal ground 2 SGND 7 VP Cm power stage power ground 5 (substrate)
MLC351
6
output 2
PGND
Fig.1 Block diagram.
1998 Apr 28
3
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
PINNING SYMBOL -INV1 SGND SVRR OUT1 PGND OUT2 VP M/SS -INV2 PIN 1 2 3 4 5 6 7 8 9 non-inverting input 1 signal ground
TDA1517; TDA1517P
DESCRIPTION
supply voltage ripple rejection output output 1 power ground output 2 supply voltage mute/standby switch input non-inverting input 2
ndbook, halfpage
INV1 SGND SVRR OUT1 PGND OUT2 VP M/SS INV2
1 2 3 4 5 6 7 8 9
MLC352
ndbook, halfpage
INV1 SGND SVRR OUT1
1 2 3 4 5 6 7 8 9
MLC353
18 17 16 15 TDA1517P 14 13 12 11 10
TDA1517
PGND OUT2 VP M/SS INV2
Pins 10 to 18 should be connected to GND or floating.
Fig.2 Pin configuration for SOT110-1.
Fig.3 Pin configuration for SOT398-1.
FUNCTIONAL DESCRIPTION The TDA1517 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 20 dB. A special feature of the device is the mute/standby switch which has the following features: * Low standby current (<100 A) * Low mute/standby switching current (low cost supply switch) * Mute condition. 1998 Apr 28 4
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP VP(sc) VP(r) ERGO IOSM IORM Ptot Tstg Tamb Tc PARAMETER supply voltage AC and DC short-circuit safe voltage reverse polarity energy handling capability at outputs non-repetitive peak output current repetitive peak output current total power dissipation storage temperature operating ambient temperature crystal temperature see Fig.4 VP = 0 V CONDITIONS
TDA1517; TDA1517P
MIN. - - - - - - - -55 -40 -
MAX. 18 18 6 200 4 2.5 15 +150 +85 150 V V V
UNIT
mJ A A W C C C
THERMAL RESISTANCE SYMBOL Rth j-c Rth j-p Rth j-a TYPE NUMBER TDA1517 TDA1517P PARAMETER thermal resistance from junction to case thermal resistance from junction to pins 8 15 VALUE UNIT K/W K/W K/W
TDA1517; TDA1517P thermal resistance from junction to ambient 50
handbook, halfpage
18
MLC354
P (W) 12 (1)
(2) 6
0 25 0 50 100 150 o T amb ( C)
(1) Rth j-c = 8 K/W. (2) Rth j-p = 15 K/W.
Fig.4 Power derating curve.
1998 Apr 28
5
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured in Fig.6; unless otherwise specified. SYMBOL Supply VP Iq(tot) VO V8 VO Isb Vsw Note supply voltage total quiescent current DC output voltage note 1 PARAMETER CONDITIONS
TDA1517; TDA1517P
MIN.
TYP.
MAX.
UNIT
6.0 - -
14.4 40 6.95 - - - 12
18.0 80 - -
V mA V
Mute/standby switch switch-on voltage level see Fig.5 8.5 - - - V
Mute condition output signal in mute position VI(max) = 1 V; fi = 20 Hz to 15 kHz 2 mV A A
Standby condition DC current in standby condition switch-on current 100 40
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.
1998 Apr 28
6
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; measured in Fig.6; unless otherwise specified. SYMBOL Po THD flr fhr Gv SVRR PARAMETER output power total harmonic distortion low frequency roll-off high frequency roll-off closed loop voltage gain supply voltage ripple rejection on mute standby |Zi| Vno input impedance noise output voltage on on mute cs |Gv| Notes 1. Output power is measured directly at the output pins of the IC. 2. Frequency response externally fixed. 3. Ripple rejection measured at the output with a source impedance of 0 , maximum ripple amplitude of 2 V (p-p) and a frequency between 100 Hz and 10 kHz. 4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage independent of Rs (VI = 0 V). channel separation channel unbalance Rs = 0 ; note 4 Rs = 10 ; note 4 note 5 Rs = 10 - - - 40 - 50 70 50 - 0.1 - 100 - - 1 V V V dB dB note 3 48 48 80 50 - - - 60 - - - 75 dB dB dB k CONDITIONS THD = 0.5%; note 1 THD = 10%; note 1 Po = 1 W at -3 dB; note 2 at -1 dB 4 5.5 - - 20 19 MIN. 5 6.0 0.1 45 - 20 TYP. - - - - - 21 MAX. UNIT W W % Hz kHz dB
1998 Apr 28
7
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
handbook, halfpage
18 V11 (V)
8.5 6.4
3.3 2 0
,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,,
MLC355
ON (IP = 40 mA)
mute (IP = 40 mA)
standby (I P
100 A)
Fig.5 Standby, mute and on conditions.
APPLICATION INFORMATION
handbook, full pagewidth
standby switch 100 F 3 input reference voltage internal 1/2 V P 8 7 VP 100 nF 2200 F
TDA1517
220 nF input 1 60 k 1 20 dB 20 dB 60 k 9 220 nF input 2
2
5 1000 F
4
6
MLC356
signal ground
power ground
1000 F
Fig.6 Application circuit diagram.
1998 Apr 28
8
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
PACKAGE OUTLINES SIL9MPF: plastic single in-line medium power package with fin; 9 leads
TDA1517; TDA1517P
SOT110-1
D
D1 q P P1 A2
A3 q1 q2
A A4 seating plane E pin 1 index
L 1 Z b2 e b b1 wM 9 Q
c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-25
1998 Apr 28
9
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
HDIP18: plastic heat-dissipating dual in-line package; 18 leads
SOT398-1
D seating plane
ME
A2
A
A1 L
Z
e
b1 b b2 10
wM
c (e 1) MH
18
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.02 A2 max. 3.7 0.15 b 1.40 1.14 0.06 0.04 b1 0.67 0.50 0.03 0.02 b2 1.05 0.75 0.04 0.03 c 0.47 0.38 0.02 0.01 D (1) 21.85 21.35 0.87 0.84 E (1) 6.5 6.2 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.1 0.15 0.12 ME 8.32 8.02 0.33 0.32 MH 8.7 7.7 0.34 0.30 w 0.25 0.01 Z (1) max. 1.0 0.04
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT398-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 94-04-13 95-01-25
1998 Apr 28
10
Philips Semiconductors
Product specification
2 x 6 W stereo power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1517; TDA1517P
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Apr 28
11
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/03/pp12
Date of release: 1998 Apr 28
Document order number:
9397 750 03772

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